TOP > Advanced Integrated Electronics Research Core

Advanced Integrated Electronics Research Core

	Prof. Hiroyuki ITO
	Room	J2	Mail-Box	J2-31
	TEL	045-924-5010
	E-mail	ito(at)nasu.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	http://ateal.jp/
Research Field	Integrated Circuits, RF Circuits, Sensor Networks, IoT and Applictaion
Objective	Research on interface technology to connect real space and cyberspace
Current Topics	Ultra Low Power Wireless Sensor Circuit Technology Low Noise Circuit Technology Monitoring Technology for Dairy Husbandry IT Technology for Agriculture Measurement Technology for Dental Therapy

Low-Phase-Noise Fractional-N Synthesizer for Wireless Communication.

Monitoring Technology for Dairy Husbandry

	Prof. Takashi TOKUDA
	Room	S9	Mail-Box	S9-11
	TEL	03-5734-2211
	E-mail	tokuda(at)ee.e.titech.ac.jp　Please replace “(at)” with “@”.
	HomePage	http://www.tokuda-lab.ee.e.titech.ac.jp/index_e.html
Research Field	CMOS-based microdevices and systems
Objective	Development of circuit technology for ultra-small wireless devices and sensors for biomedical and IoT applications
Current Topics	CMOS-controlled photovoltaic power transfer and energy harvesting Wireless, ultra-small Implantable optogenetic stimulator IoT micronode device for “Bottom-up IoT” technology Implantable glucose sensor On-chip opto-electronic image sensor

Ultra-small Implantable optogenetic stimulator

Implantable glucose sensor

	Prof. Takayuki OHBA（Specially Appointed）
	Room	S9	Mail-Box	S9-11
	TEL	03-5734-2211
	E-mail	takayuki.ohba(at)first.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	BBCube LSI Semiconductor Process Development and Applications
Objective	To develop the cutting-edge BBCube three-dimensional large-scale integration technology and drive the semiconductor industry beyond scaling.
Current Topics	Development of mass-production-ready WOW/COW processes, equipment, and materials. BBCube 2.5D/3D system development. BBCube thermal design and heat dissipation technology development. Wide-bandgap materials research. Social implementation through the WOW Alliance.


Bumpless vertical interconnects between wafers

Prof. Kuan-Neng CHEN（Specially Appointed）〔Ito Lab〕
Room	J3	Mail-Box	J3-132
TEL	045-924-5866
E-mail	chien.k.0dea(at)m.isct.ac.jp　Please replace “(at)” with “@”.
HomePage

	Prof. Norio CHUJO（Specially Appointed）
	Room	R2棟	Mail-Box	R2-32
	TEL	045-924-5083
	E-mail	chuujou.n.813f(at)m.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	Design and architecture of BBCube 3D integration
Objective	Development of semiconductor technologies that achieve both high performance and low.
Current Topics	Research and development of BBCube 3D systems stacking xPUs (e.g., CPUs and GPUs), memory, and voltage regulators Development of low-power, high-bandwidth inter-chip communication technologies for 2.5D/3D integration Development of vertically integrated high-efficiency power delivery solutions Advanced thermal design and heat dissipation technology development

BBCube 3D configuration
・Multi-xPU/IVR/Multi-Memory Vertical Stack
・WOW and COW Hybrid Processes
・Cu-Damascene Via-Last TSVs)

Prof. Shiro DOSHO（Specially Appointed）〔Ito Lab〕
Room	J2	Mail-Box	J2-31
TEL	045-924-5019
E-mail	dosho(at)first.iir.isct.ac.jp　Please replace “(at)” with “@”.
HomePage	http://ateal.jp/

	Prof. Tomoji NAKAMURA（Specially Appointed）〔Ito Lab〕
	Room	R2	Mail-Box	R2-32
	TEL	045-924-5083
	E-mail	tomoji.nakamura(at)irst.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	Heat exchange and heat transport technologies in electronic products
Objective	Improve cooling efficiency of the overall system by dispersing, transporting, and exchanging heat generated by electronic products using gas-liquid two-phase flow.
Current Topics	Development of cooling devices that disperse, transport, and exchanging heat generated by electronic devices with high power consumption using gas-liquid two-phase flow. Computational Fluid Dynamics simulation for 2-phase flow that covers evaporation, transport, and coagulation of water in an integrated manner.

Schematic cross section of vapor chamber (VC)

Heat transfer performance of the prototype VC

	Prof. Takashi YODA（Specially Appointed）〔Ohba Lab〕
	Room	R2棟	Mail-Box	R2-32
	TEL	045-924-5083
	E-mail	takashi.yoda(at)first.iir.isct.ac.jp　Please replace “(at)” with “@”.
	HomePage	https://www.wow.first.iir.isct.ac.jp/
Research Field	Wide Band Gap (WBG) Semiconductor Technology
Objective	Development of the High performance SiC/(GaN) devices
Current Topics	Defect-Free Engineering 　- Lifetime Measurement 　- Dislocation Modeling Diagnotics Technology Advanced Application of WBG Devices


Lifetime measurement for n-Buffer SiC layer	Hyperspectral Raman Imaging of 4H-SiC BPD

	Prof. Young Suk KIM （Visiting）〔Ito Lab〕
	Room：J3	Mail-Box：J3-132
	TEL：045-924-5866
	E-mail：youngsuk.k.aa(at)m.titech.ac.jp Please replace “(at)” with “@”.
	HomePage: http://www.wow.pi.titech.ac.jp/

Research Field　Process Integration Development for 3D LSI Devices
Objective　To develop ultra-thinning of 300-mm device wafers and those stack process integration
technology for three-dimensional LSI technology. Because the physical interconnects length becomes 1/10 using ultra-thin wafers and Wafer-on-Wafer (WOW) process, high performance 3D devices with low power consumption will be realized.
Current Topics
・Ultra-thinning 300-mm DRAM wafer down to 2-μm
・Bumpless vertical interconnects between wafers
・Analyses of defect generation and device characteristics for thinned device wafer

Thinned DRAM 300mm wafer

	Assoc. Prof. Atsushi SHIRANE
	Room: S9	Mail-Box: S3-28
	TEL: 03-5734-3764
	E-mail: shirane(at)ee.e.titech.ac.jp Please replace “(at)” with “@”.
	HomePage: https://shirane-lab.ee.e.titech.ac.jp/index-e.html

Research Field　Integrated Circuits for Wireless Communication and Wireless Power Transfer
Objective　Creation of Integrated Circuits Technology for Wireless Communication to be Deployed in Space and Green Wireless Power Transfer
Current Topics
・RF Integrated Circuits for Small Satellite
・Battery-less Wirelessly-Powered 5G Integrated Circuits
・Radiation Hardened Wireless Transceiver, RF Fingerprints using Machine Learning, etc

Radiation Hardened Ultra-Low-Power Ka-band
RFIC and Wireless Transceiver for Small Satellite

Spaceborne Phased-Array Transceiver on Non-Planar Deployable Membrane Structure

	Assoc. Prof. Satoshi SUGAHARA
	Room: J3	Mail-Box: J3-14
	TEL: 045-924-5184
	E-mail: sugahara.s.aa(at)m.titech.ac.jp Please replace “(at)”with “@”.
	HomePage: https://www.first.iir.titech.ac.jp/sugaharalab/

Research Field　Integrated devices,
Integrated circuits, Micro thermoelectric generators
Objective
・Ultralow-power CMOS memory, Energy-efficient CMOS logic
・Nonvolatile memory, Beyond-CMOS device, Thermoelectric generator technology
Current Topics
・Ultralow-voltage retention SRAM
・Energy minimum-point operation SRAM/neural-network accelerator
・Thin-film micro thermoelectric generator using body heat
・Piezoelectronic transistor，Nonvolatiole SRAM

Ultralow-voltage retention SRAM macro

Nonvolatile SRAM macro

	Lecturer Shuichiro YAMAMOTO（Specially Appointed）〔Sugahara Lab〕
	Room: J3	Mail-Box: J3-14
	TEL: 045-924-5456
	E-mail: sh_yamamoto(at)isl.titech.ac.jp Please replace “(at)”with “@”.
	HomePage: https://www.first.iir.titech.ac.jp/sugaharalab/

	Asst. Prof. Masato SAITO
	Room: S9	Mail-Box: S9-11
	TEL: 03-5734-3811
	E-mail: saito.m.bg(at)m.titech.ac.jp Please replace “(at)”with “@”.
	Homepage: http://www.tokuda-lab.ee.e.titech.ac.jp//

Current Topics
・Implantable flexible electronic devices for medical applications
・Polymer thin-film electronics using nanomaterial printing and transfer technology

Thin-film device that generates heat by an external wireless power supply

	Asst. Prof. Carolyn Jill MAYEDA（Specially Appointed）〔Shirane Lab〕
	Room: S9	Mail-Box: S9-6
	TEL: 03-5734-3754
	E-mail: mayeda.j.89b2(at)m.isct.ac.jp Please replace “(at)” with “@”.
	Homepage: https://www. shirane-lab.ee.e.titech.ac.jp

Current Topics
・SATCOM TRX Phased Arrays
・Heterogeneous TRXs
・GaAs and CMOS IC design


Recent Heterogeneous TRX for SATOM using a 0.1 µm D-mode GaAs technology and a 65 nm CMOS technology.

Organization